doc. no : qw0905-LDGM4843Z rev : a date : 13 - apr. - 2007 data sheet cylindrical type led lamps LDGM4843Z pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
+ - 1.0 3.8 3.0 3.8 0.5 typ 1.5max 1.0min 2.54typ 25.0min 30 60 50%75%100% -30 -60 25% 0 50%25% 100% 75% 0 directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions part no. LDGM4843Z ligitek electronics co.,ltd. property of ligitek only page 1/5 - dgm zener +
note : 1.the forward voltage data did not including " 0.1v testing tolerance. 2. the luminous intensity data did not including " 15% testing tolerance. absolute maximum ratings at ta=25 # i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 # ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 120 -30 ~ +100 -20 ~ +80 ir 8000 50 ratings dgm 100 30 mw # v # $ a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 110 viewing angle 2 % 1/2 (deg) min. 350 20 typ. 3.5 forward voltage @ ma(v) max. 4.0 peak wave length & pnm 518 spectral halfwidth '& nm 36 typ. luminous intensity @20ma(mcd) 550 emitted green part no LDGM4843Z material ingan/gan lens color water clear dominant wave length & dnm 525 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LDGM4843Z
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/5 page part no. LDGM4843Z
page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 temp( c) 2 /sec max 100 50 preheat 120 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LDGM4843Z
description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. high temperature high humidity test solder resistance test thermal shock test low temperature storage test high temperature storage test test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) reliability test: operating life test test item mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard 5/5 page part no. LDGM4843Z
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